p k118 (v1. 3 ) november 12 , 20 13 www.xilinx.com 1 ? 200 6 xilinx, inc. all rights reserved. all xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to change without notice. xilinx believes this environmental information to be correct, but can not guarantee its completeness or accuracy as it is based on data received from sources outside our company. 100% material declaration data sheet pdg8 pk 1 1 8 ( v 1. 3 ) november 12 , 20 13 material declaration data sheet average weight: 0.528 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.00665 0 1.26% silicon 7440 - 21 - 3 100.00 0.006653 die attach material 0.00198 0 0.37% resin trade secret 21.00 0.000415 silver 7440 - 22 - 4 70.00 0.001383 metal oxide trade secret 3.00 0.000059 amine trade secret 3.00 0.000059 gamma butyrolactone trade secret 3.00 0.000059 mold compound 0.31824 0 60.31% resin type ortho cresol novolac trade secret 13.50 0.042962 sio2 60676 - 86 - 0 86.50 0.275278 leadframe 0.18984 0 35.98% copper 7440 - 50 - 8 97.50 0.185099 iron 7439 - 89 - 6 2.35 0.004461 phosphorus 7723 - 14 - 0 0.03 0.000057 zinc 7440 - 66 - 6 0.12 0.000228 leadframe plating 0.00135 0 0.26% silver 7440 - 22 - 4 100.00 0.00135 0 bond wire 0.00041 0 0.08% gold 744 0 - 57 - 5 100.00 0.000414 ext. plating 0.00916 0 1.74% tin 7440 - 31 - 5 100.00 0.009164
100% material declaration data sheet C pdg8 2 www.xilinx.com PK118 (v1. 3 ) november 12 , 20 13 revision history the following table shows the revision history for this document. date revision revision 3/ 08 /06 1.0 initial initial release. 7/05 /06 1.1 100% material declaration. 9/2 8 /06 1.2 updated component descriptions. 11/12/06 1.3 new epoxy mold compound composition
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